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基于FLUENT的废线路板元器件脱焊数值模拟

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张少军, 李新新, 刘国勇, 尹凤福, 油红科. 基于FLUENT的废线路板元器件脱焊数值模拟[J]. 环境工程学报, 2011, 5(2): 414-418.
引用本文: 张少军, 李新新, 刘国勇, 尹凤福, 油红科. 基于FLUENT的废线路板元器件脱焊数值模拟[J]. 环境工程学报, 2011, 5(2): 414-418.
shu
Zhang Shaojun, Li Xinxin, Liu Guoyong, Yin Fengfu, You Hongke. Numerical simulation on welding in dismantling components of waste printed circuit board based on FLUENT[J]. Chinese Journal of Environmental Engineering, 2011, 5(2): 414-418.
Citation: Zhang Shaojun, Li Xinxin, Liu Guoyong, Yin Fengfu, You Hongke. Numerical simulation on welding in dismantling components of waste printed circuit board based on FLUENT[J]. Chinese Journal of Environmental Engineering, 2011, 5(2): 414-418.
shu

基于FLUENT的废线路板元器件脱焊数值模拟

  • 1.

    北京科技大学机械工程学院，北京 100083

  • 2.

    海尔集团技术研发中心，青岛 266101

  • 基金项目:

    国家自然科学基金资助项目（50775058）

  • 中图分类号: X705

Numerical simulation on welding in dismantling components of waste printed circuit board based on FLUENT

  • 1.

    School of Mechanical Engineering, University of Science and Technology Beijing, Beijing 100083, China

  • 2.

    Haier Group’s R & D Center, Haier Group, Qingdao 266101, China

  • Fund Project:

  • 摘要: 带元器件的废线路板的手工拆解劳动繁重，在拆解中产生的有害气体损害工人的健康，拆解后的残留物污染环境，因此，废线路板的自动拆解就显得十分必要。针对废线路板上电子元器件自动拆解中焊点的熔焊问题，采用FLUENT计算机软件进行模拟研究，分析了导热介质、初始温度、流体速度对焊点加热熔化效率的影响。结果表明，焊点在初始温度为473～483 K，流速为0.2～0.5 m/s的硅油中拆解效率较高。
    Abstract: Manual dismantling of waste printed circuit board with components is a laborious work, the harmful gases produced during the dismantling affect the health of workers, and disassembled residues pollute the environment. Therefore, the automatic dismantling of waste printed circuit board becomes very necessary. Numerical simulation was performed by software-FLUENT to study the heating and melting efficiency of solder joints during automatic dismantling (process) of electronic components on waste printed circuit board. The factors considered included different heat conduction media, initial temperature and fluid velocity.The results showed that solder joints had a higher dismantling efficiency in silicone oil at the initial temperature of 473～483 K and flow velocity of 0.2～0.5 m/s.
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  • 收稿日期:  2010-01-11
张少军, 李新新, 刘国勇, 尹凤福, 油红科. 基于FLUENT的废线路板元器件脱焊数值模拟[J]. 环境工程学报, 2011, 5(2): 414-418.
引用本文: 张少军, 李新新, 刘国勇, 尹凤福, 油红科. 基于FLUENT的废线路板元器件脱焊数值模拟[J]. 环境工程学报, 2011, 5(2): 414-418.
shu
Zhang Shaojun, Li Xinxin, Liu Guoyong, Yin Fengfu, You Hongke. Numerical simulation on welding in dismantling components of waste printed circuit board based on FLUENT[J]. Chinese Journal of Environmental Engineering, 2011, 5(2): 414-418.
Citation: Zhang Shaojun, Li Xinxin, Liu Guoyong, Yin Fengfu, You Hongke. Numerical simulation on welding in dismantling components of waste printed circuit board based on FLUENT[J]. Chinese Journal of Environmental Engineering, 2011, 5(2): 414-418.
shu

基于FLUENT的废线路板元器件脱焊数值模拟

  • 1. 北京科技大学机械工程学院，北京 100083
  • 2. 海尔集团技术研发中心，青岛 266101
  • 收稿日期:  2010-01-11
基金项目:

国家自然科学基金资助项目（50775058）

摘要: 带元器件的废线路板的手工拆解劳动繁重，在拆解中产生的有害气体损害工人的健康，拆解后的残留物污染环境，因此，废线路板的自动拆解就显得十分必要。针对废线路板上电子元器件自动拆解中焊点的熔焊问题，采用FLUENT计算机软件进行模拟研究，分析了导热介质、初始温度、流体速度对焊点加热熔化效率的影响。结果表明，焊点在初始温度为473～483 K，流速为0.2～0.5 m/s的硅油中拆解效率较高。

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